Mixed mode fracture toughness of lead–tin and tin–silver solder joints with nickel-plated substrate

✍ Scribed by K.S. Siow; M. Manoharan

• Book ID: 108214460
• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 775 KB
• Volume: 404
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2005.05.086