✦ LIBER ✦
A comparative study of silver-epoxy and tin-lead solder in their joints with copper, through mechanical and electrical measurements during debonding
✍ Scribed by X. Luo; D. D. L. Chung
- Book ID
- 111534571
- Publisher
- Springer
- Year
- 1999
- Tongue
- English
- Weight
- 245 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0022-2461
No coin nor oath required. For personal study only.