Migration of Silver from Silver-Loaded Polyimide Adhesive Chip Bonds at High Temperatures

✍ Scribed by Chaffin, R.

• Book ID: 117911371
• Publisher: IEEE
• Year: 1981
• Tongue: English
• Weight: 549 KB
• Volume: 4
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/tchmt.1981.1135799