Migration of silver from silver-loaded polyimide adhesive chip bonds at high temperatures: Roger J. Chaffin. IEEE Trans. Components. Hybrids, Mfg Technol. Chmt-4, (2) p. 214 (June 1981)

• Book ID: 108362030
• Publisher: Elsevier Science
• Year: 1982
• Tongue: English
• Weight: 122 KB
• Volume: 22
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/s0026-2714(82)80207-2