Microwave Material Applications: Device Miniaturization and Integration

✍ Scribed by David B. Cruickshank

• Publisher: Artech House Publishers
• Year: 2016
• Tongue: English
• Leaves: 239
• Category: Library

✦ Synopsis

This comprehensive new resource based on the classic Artech House title, Microwave Materials for Wireless Applications, introduces the use of new microwave materials for passive devices including ferrites, magnetization garnets, dielectric materials, and absorbers for wireless and antenna applications. This book explores a new set of magnetic and dielectric materials that assist with size reduction of passive devices such as ferrite isolators and circulators. Revised data on the applications of absorbers, including examples of different combinations of magnetic, dielectric, and absorber materials into integrated devices is presented. Meta-materials for antennas and potential antenna integration onto soft boards or LTCC filter technologies using tunable devices with new materials are covered.

✦ Table of Contents

Microwave Material Applications:
Device Miniaturization and Integration
Contents
Preface
Introduction
Acknowledgments
1
New Magnetic Materials
1.1 New High Magnetization Garnets for Microwave Magnetic Devices
1.2 The Structure of Garnets
1.3 The Magnetization and Curie Temperature of Bismuth-Substituted YIG
1.4 Dielectric Constant and Bismuth Content
1.5 Octahedral Substitution
1.6 Comparison with Existing YIG-Based Materials
1.7 Device Considerations
References
Selected Bibliography
2
New Magnetic Materials: Expanding Applications
2.1 Higher-Frequency Devices Using New Low-Magnetization Garnets
2.2 Choice of Substitute Elements
2.3 Nonmagnetic Tetrahedral Substitution
2.4 Vanadium Substitution
2.5 Aluminum Substitution
2.6 Gadolinium Substitution
2.7 Comparison with Existing Materials
References
3
Miniaturization of Ferrite Devices Using High Dielectric Constant Ferrite
3.1 Description of the Junction Circulator Mode
3.2 Experimental Proof of Size Reduction
3.3 Device Implications of Dielectric Constant
3.4 Miniaturization of Other Ferrite Devices
3.5 High Dielectric Constant Garnet and Latching and Switching Devices
3.6 Low-Frequency Antennas
References
Selected Bibliography
4
Dielectrics
4.1 Background
4.2 High Dielectric Constant Materials
4.3 Perovskites
4.4 Tetragonal Tungsten Bronze Dielectrics (TTBs)
4.5 Bismuth Niobium-Based Systems
4.6 Summary of Candidate Dielectrics
4.7 Low Dielectric Constant Materials (LTCC)
4.8 LTCC Integration
4.9 Low Dielectric Constant MICs
4.10 Low Dielectric Constant Soft-Substrate Hybrid Assembly
References
5
Further Miniaturization with Combinations of Bismuth Garnets and Dielectrics
5.1 Introduction
5.2 Above-Resonance Operation
5.3 Below-Resonance Operation
5.4 Microstrip Devices
References
Selected Bibliography
6
Absorbers
6.1 Introduction
6.2 Low-Permittivity, Magnetic/Dielectric Composite Absorbers
6.3 Ferroelectric Absorbers Based on BaTiO3
6.4 Combinations of Ferroelectric and Magnetic Absorbers
6.5 Commercial Absorbers as Loads
6.6 New Materials Based on Magnetic Metal Combinations
6.7 Ferrite-Based Absorbers
6.8 Hexagonal Ferrites as Absorbers
6.9 Ferrite Polymer Composites as Absorbers
6.10 Alternate Ferroelectric Absorbers
6.11 Low-Temperature Firing Absorbers
6.12 Very High-Power Absorbers
References
Selected Bibliography
7
Dielectric and Magnetic Integration
7.1 First Steps in Integration and Their Effect on Microwave Performance
7.2 Nonmagnetic Garnets as Dielectric Substrates
7.3 Combinations of Garnets
7.4 Performance Enhancement: Insertion Loss and Intermodulation
7.5 Other Sources of Insertion Loss in Magnetic Devices
7.6 Intermodulation (IMD)
7.7 Below-Resonance IMD Reduction
7.8 IMD in Dielectrics
7.9 IMD and Harmonics in Systems
References
8
Antennas
8.1 Antenna Application Trends
8.2 MIMO and Massive MIMO
8.3 Patch Antennas
8.4 Patch Antenna Realizations
8.5 Enhanced Patch Antennas Using RIS and EBG
8.6 Antenna Arrays
8.7 Ferrite-Based Patch Antennas
References
9
Filters
9.1 Cellular Transceiver Filters
9.2 Edge-Coupled Microstrip Filters
9.3 Coaxial Dielectric TEM Filters
9.4 Couplers and Baluns
9.5 Acoustic Filters
9.6 SAW Filters
9.7 Bulk Acoustic Wave Filters
9.8 Dielectric Resonator-Based Filters
9.9 Performance and Integration Summary for Filter Types
References
10
Tunable Devices
10.1 Classes of Tunable Materials
10.2 Types of Devices
10.3 Microstrip/Stripline Filter Tuning
10.4 Paraelectric Materials as Tunable Elements
10.5 Magnetic Tuning
10.6 Tunable Devices Based on Ferrite Biased to Resonance
10.7 Tunable SIW Filters
10.8 Tunable Coaxial Dielectric TEM Resonators
10.9 Tunable Acoustic Filters
10.10 Piezoelectric and Paraelectric-Based Filters
10.11 Switchable Devices
10.12 Smart Antennas and Phased Arrays
10.13 Tunable TE and TM Filters
10.14 Summary and Conclusions
References
11
Subsystem Integration
11.1 Transceiver Integration
11.2 Integration of Ferroelectric Devices
11.3 Antenna Integration
11.4 Low- to High-Powered Base Stations
11.5 Transceiver Topology
11.6 Summary of Base Station Filter Options
11.7 Antenna Considerations
11.8 Soft Board Versus Ceramic Microstrip and LTCC
References
12
New Manufacturing Techniques for Dielectric and Magnetic Materials Used in Microwave Devices
12.1 Introduction
12.2 Additive Manufacturing
12.3 AM Devices Using Plastic and Metal Only
12.4 Ceramic AM
12.5 Stereolithography (SL) Applied to Microwave Circuits and Components
12.6 Cofired Composite Structures Using AM
12.7 Ceramic Injection Molding (CIM)
12.8 Sol-Gel Processing
12.9 Bismuth Containing Garnets and Sol-Gel
12.10 Bismuth Zinc Niobate Dielectric by Sol-Gel
12.11 Magnetic Spinel and Hexagonal Ferrites by Sol-Gel
12.12 Lead Zirconium Titanate (PZT) Piezoelectrics by Sol-Gel
12.13 Thin-Film Deposition
References
About the Author
Index