Microsystem Technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2010

✍ Scribed by Bernard Courtois; Bernd Michel

• Publisher: Springer-Verlag
• Year: 2011
• Tongue: English
• Weight: 92 KB
• Volume: 17
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-011-1296-9