Microsystem technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2009

✍ Scribed by Bernard Courtois; Bernd Michel

• Publisher: Springer-Verlag
• Year: 2010
• Tongue: English
• Weight: 80 KB
• Volume: 16
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-010-1082-0