Microsystem Design

✍ Scribed by Stephen D. Senturia (auth.)

• Publisher: Springer US
• Year: 2002
• Tongue: English
• Leaves: 693
• Edition: 1
• Category: Library

✦ Synopsis

It is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book’s publication will mark an important milestone in the continuing worldwide development of microsystems. By bringing together all aspects of microsystem design, it can be expected to facilitate the training of not only a new generation of engineers, but perhaps a whole new type of engineer – one capable of addressing the complex range of problems involved in reducing entire systems to the micro- and nano-domains. This book breaks down disciplinary barriers to set the stage for systems we do not even dream of today. Microsystems have a long history, dating back to the earliest days of mic- electronics. While integrated circuits developed in the early 1960s, a number of laboratories worked to use the same technology base to form integrated sensors. The idea was to reduce cost and perhaps put the sensors and circuits together on the same chip. By the late-60s, integrated MOS-photodiode arrays had been developed for visible imaging, and silicon etching was being used to create thin diaphragms that could convert pressure into an electrical signal. By 1970, selective anisotropic etching was being used for diaphragm formation, retaining a thick silicon rim to absorb package-induced stresses. Impurity- and electrochemically-based etch-stops soon emerged, and "bulk micromachining" came into its own.

✦ Table of Contents

Introduction....Pages 3-14
An Approach to Mems Design....Pages 15-28
Microfabrication....Pages 29-78
Process Integation....Pages 79-99
Lumped Modeling with Circuit Elements....Pages 103-124
Energy-conserving Transducers....Pages 125-147
Lumped-element System Dynamics....Pages 149-180
Elasticity....Pages 183-200
Structures....Pages 201-238
Energy Methods....Pages 239-265
Dissipation and the Thermal Energy Domain....Pages 267-297
Lumped Modeling of Dissipative Processes....Pages 299-315
Fluids....Pages 317-350
Electronics....Pages 353-396
Feedback Systems....Pages 397-423
Noise....Pages 425-450
Packaging....Pages 453-468
A Piezoresistive Pressure Sensor....Pages 469-495
A Capacitive Accelerometer....Pages 497-530
Electrostatic Projection Displays....Pages 531-560
A Piezoelectric Rate Gyroscope....Pages 561-604
Microsystems for DNA Amplification....Pages 605-627
A Microbridge Combustible-gas Sensor....Pages 629-664

✦ Subjects

Electronic and Computer Engineering;Optical and Electronic Materials;Mechanics