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Microstructure of electrodeposited NiFe/Cu multilayers

✍ Scribed by A. TOKARZ; P. WIECZOREK; A.K. LIS; J. MORGIEL


Book ID
108866758
Publisher
John Wiley and Sons
Year
2010
Tongue
English
Weight
359 KB
Volume
237
Category
Article
ISSN
0022-2720

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The effect of the thickness of the copper layers on the microstructure and magnetoresistance of electrodeposited Co/Cu multilayers was investigated by using the combination of wide-angle and small-angle X-ray scattering, transmission electron microscopy with high resolution and magnetoresistance mea