✦ LIBER ✦

Microstructure evolution of periodic layers formed during solid state reaction between Zn and Ni3Si

✍ Scribed by Chen, Y.C.; Zhang, X.F.; Ren, Y.K.; Han, L.; Lin, D.Y.; Wang, Q.P.

Book ID: 123348971
Publisher: Elsevier Science
Year: 2013
Tongue: English
Weight: 803 KB
Volume: 36
Category: Article
ISSN: 0966-9795
DOI: 10.1016/j.intermet.2012.12.015

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Growth behavior of Ni3Sn4 layer during r

Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures

✍ M. Mita; M. Kajihara; N. Kurokawa; K. Sakamoto 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 226 KB

The solid-state reactive diffusion between Ni and Sn was experimentally studied using Sn/Ni/Sn diffusion couples. The diffusion couples were prepared by a diffusion bonding technique and then annealed at temperatures between T = 433 and 473 K for various times in an oil bath with silicone oil. At th

The nature of the interaction layers for

The nature of the interaction layers formed during the reaction between solid titanium and aluminium vapour

✍ N.R. Short; J. Mackowiak 📂 Article 📅 1976 🏛 Elsevier Science ⚖ 677 KB

Fast Concurrent Growth of Ni3Sn4and Void

Fast Concurrent Growth of Ni3Sn4and Voids During Solid-State Reaction Between Sn-Rich Solder and Ni Substrates

✍ Bo-Mook Chung; Jaeho Choi; Joo-Youl Huh 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 890 KB

The nature and growth of interaction lay

The nature and growth of interaction layers formed during the reaction between solid titanium and liquid aluminium

✍ J. Mackowiak; L.L. Shreir 📂 Article 📅 1959 🏛 Elsevier Science ⚖ 1020 KB