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Microstructure and thermo-physical properties of a SiC/pure-Al composite for electronic packaging

✍ Scribed by Zhang, Qiang; Jiang, Longtao; Wu, Gaohui

Book ID
121560786
Publisher
Springer US
Year
2013
Tongue
English
Weight
387 KB
Volume
25
Category
Article
ISSN
0957-4522

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An ultra‐high‐temperature ceramic (UHTC) based on HfB~2~ was produced. The microstructure consisted of fine and regular diboride grains (2 ΞΌm average size), with SiC particulate distributed intergranularly, not rarely in clustered formation, and low levels of secondary phases were identified. The re