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Microstructure, thermo-physical and mechanical properties of spray-deposited Si–30Al alloy for electronic packaging application

✍ Scribed by Feng Wang; Baiqing Xiong; Yongan Zhang; Baohong Zhu; Hongwei Liu; Yanguang Wei

Book ID: 113780204
Publisher: Elsevier Science
Year: 2008
Tongue: English
Weight: 445 KB
Volume: 59
Category: Article
ISSN: 1044-5803
DOI: 10.1016/j.matchar.2008.01.012

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