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Microstructure and strength of the SiC/TiAl joint brazed with Ag-Cu-Ti filler metal

✍ Scribed by Liu Huijie; Feng Jicai; Qian Yiyu

Book ID
110240998
Publisher
Springer
Year
2000
Tongue
English
Weight
123 KB
Volume
19
Category
Article
ISSN
0261-8028

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Effect of Ti content on microstructure and strength of Si3N4/Si3N4 joints brazed with Cu–Pd–Ti filler metals
✍ C.F. Liu; J. Zhang; Y. Zhou; Q.C. Meng; M. Naka πŸ“‚ Article πŸ“… 2008 πŸ› Elsevier Science 🌐 English βš– 655 KB

A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si 3 N 4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si 3 N 4 joints was investigated using EPMA, SEM and three-point bendin