Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging || Lead-Free Solder Materials: Design For Reliability
β Scribed by Suhir, E.; Lee, Y. C.; Wong, C. P.
- Book ID
- 125855064
- Publisher
- Springer US
- Year
- 2007
- Weight
- 609 KB
- Category
- Article
- ISBN
- 0387279741
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al