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Method for resin seal molding


Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
182 KB
Volume
2008
Category
Article
ISSN
1350-4789

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✦ Synopsis


This patent describes a seal structure which has a seal member integrally formed on a flexible wiring board without peeling out an insulating layer on the wiring board. The seal is directly


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