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Metallorganic Chemical Vapor Deposition of TaOxNy as a High-Dielectric-Constant Material for Next-Generation Devices.

โœ Scribed by Sung-Lae Cho; Byung-Sung Kim; Hyun-Mi Kim; In Kyu Chun; Ki-Bum Kim


Publisher
John Wiley and Sons
Year
2003
Weight
63 KB
Volume
34
Category
Article
ISSN
0931-7597

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Chemical vapour deposition of the oxides
โœ Ryan C. Smith; Tiezhong Ma; Noel Hoilien; Lancy Y. Tsung; Malcolm J. Bevan; Luig ๐Ÿ“‚ Article ๐Ÿ“… 2000 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 340 KB ๐Ÿ‘ 3 views

A brief survey of the precursors used for the chemical vapour deposition of the dioxides of titanium, zirconium and hafnium is presented. The review covers precursors used for the closely related process known as atomic layer chemical vapour deposition (ALCVD or ALD). Precursors delivered by standar