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Metallographic etching reagents; II, for copper alloys, nickel, and the alpha alloys of nickel

✍ Scribed by Rawdor, H. S. (author);Lorentz, Marjorie G. (author)


Publisher
Elsevier Science
Year
1922
Tongue
English
Weight
135 KB
Volume
194
Category
Article
ISSN
0016-0032

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The enthalpies of formation at 640Β°C of solid Ni-Cu and Ni-Au alloys have been measured as a function of composition by means of a differential solution calorimeter. Both systems are characterized by positive heats of formation. The conoentration variations of the partial molar heats of solution of