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Metal adhesive properties of polyamides having the 2,3-bis(1,4-phenylene)quinoxalinediyl structure
β Scribed by Fumihiko Akutsu; Mari Inoki; Tomokazu Inagawa; Yoshio Kasashima; Yusuke Sonoda; Kenji Marushima
- Publisher
- John Wiley and Sons
- Year
- 1999
- Tongue
- English
- Weight
- 108 KB
- Volume
- 74
- Category
- Article
- ISSN
- 0021-8995
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β¦ Synopsis
Polyamides were synthesized by interfacial polycondensation of 2,3-bis(4chloroformylphenyl)quinoxaline (BCFPQ) and several aliphatic diamines using a phase transfer catalyst, and their adhesive property for stainless steel was investigated. The inherent viscosity of the obtained polyamides ranged from 0.37 to 1.24 dL g Οͺ1 . The glass transition temperatures of the polyamides ranged between 154 and 201Β°C, and their thermal decomposition temperatures were above 450Β°C. The polyamides were soluble in several organic solvents, including m-cresol, N-methyl-2-pyrrolidone (NMP), and formic acid. The adhesive property for stainless steel was examined by a standard tensile test. One member of the series, polyamide P8, derived from BCFPQ and 1,8-octanediamine, displayed high tensile strength with values of 232 kgf cm Οͺ2 at 20Β°C, 173 kgf cm Οͺ2 at 120Β°C, and 137 kgf cm Οͺ2 at 180Β°C. Thus, the tensile strength of P8 decreased at 180Β°C, but the decrease was much smaller than that of an epoxy resin in wide use as a metal adhesive. Heat distortion temperature, measured by thermal mechanical analysis, of P8 was 191Β°C. This suggested that P8 possessed high thermal resistance in metal adhesives.
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