## Abstract In order to further improve and explore the role of lasers for nerve reconstruction, this study was designed to investigate regeneration of sharply transected peripheral nerves repaired with a CO~2~ milliwatt laser in combination with three different suture materials and a bovine albumi
Mechanisms of carbon dioxide laser stereolithography in epoxy-based materials
โ Scribed by M. A. F. Scarparo; Q. J. Chen; A. S. Miller; J. H. Zhang; S. D. Allen
- Publisher
- John Wiley and Sons
- Year
- 1996
- Tongue
- English
- Weight
- 684 KB
- Volume
- 62
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
โฆ Synopsis
We present in this article the use of infrared laser radiation to achieve localized curing in thermosensitive epoxy resin compounds. In stereolithography, the objective is to cure a localized region in a material by precisely confining the laser energy to the area that is to be cured. Industry already uses ultraviolet laser radiation at 352 nm to fabricate threedimensional structures. Via infrared laser curing, we demonstrate the viability of a completely thermal localized curing process. In our experiment, we have focused the beam from a carbon dioxide (CO,) laser onto a sample composed of epoxy resin, diethylene triamine, and silica powder. Such resins typically cure, or solidify, when heated to moderately high temperatures, and our results show that we can confine the heating of the material, and, therefore, its curing in all three dimensions. We present a physical and a chemical model to describe the process and measure the curing rate as a function of temperature. In order to model the flow of heat in our sample as a result o f infrared laser irradiation, we solved the time-dependent heat equation in cylindrical coordinates using the Crank-Nicholson finite-difference method. The results allow us to predict the curing behavior of the sample as a function of laser irradiation conditions, and we find good agreement with our preliminary experimental observations.
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