Mechanical Strength of Silicon Wafers Cut by Loose Abrasive Slurry and Fixed Abrasive Diamond Wire Sawing

✍ Scribed by Hao Wu; Shreyes N. Melkote; Steven Danyluk

• Book ID: 111991997
• Publisher: John Wiley and Sons
• Year: 2012
• Tongue: English
• Weight: 569 KB
• Volume: 14
• Category: Article
• ISSN: 1438-1656
• DOI: 10.1002/adem.201100263