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This invention relates to a method for hermetically encapsulating an electronic component that is mounted in flip-chip design on a support. The method described is characterized by first covering the component with a film, which closely rests on the component and the support, then structuring the film, and providing a hermetic sealing layer, especially a metal layer, which creates a seal with the support.
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## PATENTS area on the peaks typically measures 0.2-0.6 mm. The metal profile also appears to be hollow with some form of flexible core, referred to as a 'spring insertion', but this is not discussed.
This patent describes a piston ring that is claimed to provide reduced friction and wear. The design allows independent adjustment of the parameters controlling friction and wear to eliminate the trade off between low friction and low wear typical of prior art rings. The contact interface area betwe
A mechanical seal assembly is described in which a drive pin can stably exhibit a function to prevent rotation of the stationary seal ring, and a plastic material capable of not causing contamination can be used as a structural material for the drive pin. The seal (4) has a rotary seal ring (8)
Igus has developed a maintenance-free polymer bearing material called Iglidur M250. It features a solid lubricant emb e d d e d t h r o u g h o u t the wall thickness of the bearing, thus e n s u r i n g t h a t l u b r i c a t i o n is consistent, even in the event of significant bearing wear. A v
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