Mechanical Analysis of Electronic Packaging Systems

✍ Scribed by Mckeown

• Publisher: Marcel Dekker
• Year: 1999
• Tongue: English
• Leaves: 368
• Series: Mechanical engineering 120
• Edition: 1
• Category: Library

✦ Synopsis

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

✦ Table of Contents

Preface......Page 6
Contents......Page 8
1.1 Background......Page 14
1.2 Planning The Analysis......Page 26
1.4 Conventions......Page 35
References......Page 36
2.2 Analytical Tools......Page 38
2.3 Summary of Analytical Tools......Page 50
2.5 Analytical Tool Checklist......Page 52
References......Page 54
3.1 Background......Page 56
3.3 Thermal Configuration......Page 57
3.4 Component (first) Level......Page 59
3.5 Pwbmodule (second) Level......Page 67
3.6 Chassis (third) Level......Page 74
3.7 Combining All Packaging Levels......Page 89
3.8 Special Thermal Cases......Page 103
3.9 Factors in Recent Developments......Page 107
3.11 Thermal Analysis Checklist......Page 109
3.12 References......Page 111
4.1 Background......Page 114
4.3 Mechanical Modeling......Page 115
4.4 Mechanical Dynamics Background......Page 123
4.5 Dynamic Mechanical Analysis......Page 138
4.6 Static Mechanical Analysis......Page 143
4.7 Typical Analyses......Page 146
4.8 Interpretation Of Results......Page 169
4.9 Factors In Recent Developments......Page 171
4.11 Mechanical Analysis Checklist......Page 172
References......Page 175
5.1 Background......Page 178
5.2 Solder-life Analysis......Page 184
5.3 Other Life Analysis......Page 200
5.4 Combined Thermal Cycling And Vibration......Page 205
5.5 Relative Life Analysis......Page 208
5.6 Typical Life Calculations......Page 215
5.7 Factors in Recent Developments......Page 226
5.9 Life Analysis Checklist......Page 227
References......Page 230
6.2 Fire-resistance Analysis......Page 232
6.3 Pressure Transducer Rupture......Page 247
6.4 Humidity Analysis......Page 255
6.5 Pressure-drop Analysis......Page 262
6.6 Similarity Considerations......Page 269
6.7 Energy-based Methods......Page 278
6.10 Other Analysis Checklist......Page 290
References......Page 295
7.2 Planning Tests......Page 298
7.3 Data Analysis......Page 305
7.4 Verification......Page 334
7.5 Test Data Analysis Checklist......Page 336
8.2 Reporting......Page 340
8.3 Verification......Page 346
8.4 Reportingnerification Checklist......Page 355
References......Page 357
A Abbreviations......Page 358
B Unit Conversions......Page 360
Index......Page 364