EEn......Page 1
PRACTICAL GUIDE TO THE PACKAGING OF ELECTRONICS......Page 2
PREFACE......Page 6
ACKNOWLEDGMENTS......Page 7
CONTENTS......Page 8
ISSUES IN ELECTRONICS PACKAGING DESIGN......Page 11
PACKAGING/ENCLOSURE DESIGN......Page 12
RELIABILITY......Page 13
BASIC EQUATIONS AND CONCEPTS......Page 14
GENERAL EQUATIONS......Page 15
GRASHOF NUMBER......Page 16
REYNOLDS NUMBER......Page 17
CHAPTER 3 CONDUCTIVE COOLING......Page 18
SAMPLE PROBLEM AND CALCULATIONS......Page 19
SAMPLE PROBLEM AND CALCULATIONS......Page 20
TEMPERATURE AT INTERMEDIATE POINTS......Page 23
EXERCISE: 1C TEMPERATURE DETERMINATION......Page 24
HEAT SPREADING......Page 27
EXAMPLE......Page 28
JUNCTION-TO-CASE RESISTANCE......Page 29
MODELING THE INTERFACE......Page 30
EXERCISE - CALCULATE THE COMPONENT TEMPERATURE......Page 31
A SECOND APPROACH......Page 33
A THIRD APPROACH......Page 34
2-D OR 3-D HEAT CONDUCTION......Page 36
FACTORS INFLUENCING RADIATION......Page 41
SURFACE PROPERTIES......Page 42
VIEW FACTOR CALCULATIONS......Page 43
ELECTRONICS PACKAGING PROBLEM......Page 45
FLOW IN A VERTICAL OPEN-ENDED CHANNEL......Page 50
CABINET SURFACE TEMPERATURE......Page 51
CHAPTER 5 FUNDAMENTALS OF CONVECTIVE COOLING......Page 53
FLOW REGIMES, TYPES AND INFLUENCES......Page 55
FREE (OR NATURAL) CONVECTION......Page 56
ESTIMATES OF HEAT TRANSFER COEFFICIENT......Page 57
APPROACH 2......Page 60
DESIGN TIPS......Page 63
CABINET INTERIOR AND SURFACE TEMPERATURE......Page 64
HEAT BALANCE......Page 65
BASIC PROCEDURE......Page 68
CALCULATION OF INTERNAL TEMPERATURE......Page 69
FIN DESIGN......Page 71
FORCED CONVECTION......Page 72
THE REQUIRED FLOW RATE......Page 74
BOARD SPACING AND CONFIGURATIONS......Page 77
ELEMENTS IN PARALLEL:......Page 79
SYSTEM'S IMPEDANCE CURVE......Page 81
FAN SELECTION AND FAN LAWS......Page 85
COMPONENT HOT SPOT......Page 88
INDIRECT FLOW SYSTEM DESIGN......Page 92
RESISTANCE NETWORK REPRESENTATION......Page 93
CHAPTER 6 BASICS OF SHOCK AND VIBRATION......Page 95
HARMONIC MOTION......Page 96
VIBRATION TERMINOLOGY......Page 97
FREE VIBRATION......Page 99
FIRST APPLICATION......Page 100
SECOND APPLICATION......Page 103
MODE SHAPES......Page 104
IMPACT OF DAMPING......Page 106
FORCED VIBRATION......Page 108
SAMPLE PROBLEM......Page 111
EXAMPLE 1......Page 113
EXAMPLE 2......Page 114
A PULSE SHOCK ISOLATION EXAMPLE......Page 118
A VELOCITY SHOCK ISOLATION EXAMPLE......Page 121
INDUCED STRESSES......Page 124
RANDOM VIBRATION......Page 127
EXCITATION SPECTRUM......Page 128
EQUIPMENT RESPONSE......Page 131
DYNAMIC LOADS......Page 132
EXERCISE......Page 133
CHAPTER 7 INTRODUCTION TO FINITE ELEMENT METHOD......Page 136
AN EXAMPLE OF FINITE ELEMENT FORMULATION......Page 137
FORMULATION OF CHARACTERISTIC MATRIX AND LOAD VECTOR......Page 140
WAVE PROPAGATION TYPE......Page 145
VIBRATION TYPE......Page 147
CONSISTENT MASS MATRIX......Page 148
LUMPED MASS MATRIX......Page 150
LUMPED FORMULATION......Page 151
FINITE ELEMENT FORMULATION OF HEAT CONDUCTION......Page 153
SOME BASIC DEFINITIONS......Page 155
THE FINITE ELEMENT ANALYSIS PROCEDURE......Page 156
CHAPTER 8 DESIGN AND ANALYSIS FOR MECHANICALLY RELIABLE SYSTEMS......Page 158
STRESS ANALYSIS......Page 159
ISOTROPIC BEHAVIOR......Page 162
SIMPLIFICATION OR ENGINEERING ASSUMPTIONS......Page 165
FAILURE......Page 168
FAILURE BY FRACTURE......Page 169
FAILURE BY ELASTIC DEFLECTION......Page 170
FAILURE BY FATIGUE......Page 171
LIFE EXPECTANCY......Page 172
THERMAL STRESSES AND STRAINS......Page 173
PCB WARPAGE......Page 175
SOME TIPS......Page 176
CHAPTER 9 ELECTRICAL RELIABILITY......Page 177
FIRST-YEAR FAILURES......Page 178
RELIABILITY MODELS......Page 179
SYSTEM FAILURE RATE......Page 182
CAD TO FEA CONSIDERATIONS......Page 186
CRITERIA FOR CHOOSING AN ENGINEERING SOFTWARE......Page 187
SOLID MECHANICS AND STRESS ANALYSIS - FEA SOFTWARE......Page 188
GENERAL PHYSICS - CFD AND/OR FEA......Page 189
COMPLETE PACKAGE......Page 190
CUSTOMER SUPPORT......Page 191
QUALITY ASSURANCE (QA)......Page 192
INTERFACING TO OTHER PROGRAMS......Page 194
CHAPTER 11 DESIGN CONSIDERATIONS IN AN AVIONICS ELECTRONIC PACKAGE......Page 196
OPERATIONAL CHARACTERISTICS......Page 197
ELECTRICAL DESIGN SPECIFICATIONS......Page 198
MECHANICAL DESIGN SPECIFICATIONS......Page 199
ANALYSIS......Page 200
THERMAL ANALYSIS......Page 201
LOAD CARRYING AND VIBRATION ANALYSIS......Page 202
RELIABILITY AND MTBF CALCULATIONS......Page 206
REFERENCES......Page 208