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Measuring the Young’s modulus of ultralow-k materials with the non destructive picosecond ultrasonic method

✍ Scribed by L.L. Chapelon; J. Vitiello; D. Neira; J. Torres; J.C. Royer; D. Barbier; F. Naudin; G. Tas; P. Mukundhan; J. Clerico

Book ID: 104051569
Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 339 KB
Volume: 83
Category: Article
ISSN: 0167-9317
DOI: 10.1016/j.mee.2006.10.033

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✦ Synopsis

Young's modulus, which is a measure of elastic strength, provides a good predictor of an interlevel dielectric (ILD) film's ability to withstand chemical mechanical polishing (CMP) and packaging stresses. Picosecond ultrasonics offers a high-throughput, non contact method to measure Young's modulus that is compatible with inline process monitoring. Discussion of this technique and its capability to measure on PECVD non porogen porous a-SiOC:H films with good correlation with nanoindentation and ellipsometric porosimetry (EP) measurements will be presented.

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