Young's modulus, which is a measure of elastic strength, provides a good predictor of an interlevel dielectric (ILD) film's ability to withstand chemical mechanical polishing (CMP) and packaging stresses. Picosecond ultrasonics offers a high-throughput, non contact method to measure Young's modulus
β¦ LIBER β¦
A novel, non-destructive method to measure the modulus of soft lens materials
β Scribed by Leube, Alexander; Marx, Sebastian; Sickenberger, Wolfgang
- Book ID
- 122780130
- Publisher
- Elsevier Science
- Year
- 2012
- Tongue
- English
- Weight
- 56 KB
- Volume
- 35
- Category
- Article
- ISSN
- 1367-0484
No coin nor oath required. For personal study only.
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