Copper film deposition and anode tempera
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I.I. Beilis; A. Shnaiderman; A. Shashurin; R.L. Boxman; S. Goldsmith
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Article
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2007
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Elsevier Science
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English
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Copper films deposited by a radial expanding plasma plume from a tungsten hot refractory anode vacuum arc were investigated. The arc was sustained between a consumed water-cooled cylindrical copper cathode (30 mm diameter) and a cylindrical anode (32 mm diameter, 30 mm height) that was heated by the