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Measurement of the Thermal Conductivity of Si and GaAs Wafers Using the Photothermal Displacement Technique

โœ Scribed by J. H. Kim; D. Seong; G. H. Ihm; C. Rhee


Book ID
110408756
Publisher
Springer
Year
1998
Tongue
English
Weight
542 KB
Volume
19
Category
Article
ISSN
0195-928X

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Thermal conductivity measurements of syn
โœ A.N. Petrovsky; A.O. Salnick; D.O. Mukhin; B.V. Spitsyn ๐Ÿ“‚ Article ๐Ÿ“… 1992 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 130 KB

The non-destructive and non-contact photothermal beam deflection method has been applied to thin synthetic diamond films to give thermal conductivity measurements. The thickness of the diamond film was 12-50 /zm on silicon and tungsten substrates. The maximum film thermal conductivity value obtained