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Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films

✍ Scribed by Zhao, Jie-Hua; Ryan, Todd; Ho, Paul S.; McKerrow, Andrew J.; Shih, Wei-Yan


Book ID
111898183
Publisher
American Institute of Physics
Year
1999
Tongue
English
Weight
323 KB
Volume
85
Category
Article
ISSN
0021-8979

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