✦ LIBER ✦

MCP Wafer Technology profile

Publisher: Elsevier Science
Year: 1996
Tongue: English
Weight: 327 KB
Volume: 27
Category: Article
ISSN: 0026-2692
DOI: 10.1016/s0026-2692(96)90008-7

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

MCP wafer tech streamlines

📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 159 KB

MCP - Wafer technology greater than the

MCP - Wafer technology greater than the sum of its parts

📂 Article 📅 1990 🏛 Elsevier Science 🌐 English ⚖ 183 KB

Wafer stepper technology

📂 Article 📅 1982 🏛 Elsevier Science 🌐 English ⚖ 69 KB

SOD wafer technology

✍ C.Z. Gu; Y. Sun; J.K. Jia; Z.S. Jin 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 203 KB

Silicon-on-diamond (SOD) structured wafer with 4-inch diameter was fabricated by the technologies of CVD diamond deposition, Si wafer bonding and thinning. Diamond thin film with high quality and low interface state 1 density was uniformly deposited on Silicon (001) substrate, continuous H ion bomba

ATMI partners Wafer Technology

📂 Article 📅 1996 🏛 Elsevier Science 🌐 English ⚖ 150 KB

Semiconductor wafer carrier uses Trelleb

Semiconductor wafer carrier uses Trelleborg technology

📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 148 KB