The interface crack problem of a bimaterial thermopiezoelectric solid was treated by applying the extended version of Stroh|s formalism and singular integral equation approach[ The interface crack considered is subjected to combined thermal\ mechanical and electric loads[ Under the applied loading\
Materials science: Close-up on cracks
โ Scribed by Fineberg, Jay
- Book ID
- 109806034
- Publisher
- Nature Publishing Group
- Year
- 2003
- Tongue
- English
- Weight
- 136 KB
- Volume
- 426
- Category
- Article
- ISSN
- 0028-0836
- DOI
- 10.1038/426131a
No coin nor oath required. For personal study only.
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