A closed crack tip model for interface cracks inthermopiezoelectric materials

✍ Scribed by Qing-Hua Qin; Yiu-Wing Mai

• Publisher: Elsevier Science
• Year: 1999
• Tongue: English
• Weight: 445 KB
• Volume: 36
• Category: Article
• ISSN: 0020-7683
• DOI: 10.1016/s0020-7683(98)00115-2

✦ Synopsis

The interface crack problem of a bimaterial thermopiezoelectric solid was treated by applying the extended version of Stroh|s formalism and singular integral equation approach[ The interface crack considered is subjected to combined thermal\ mechanical and electric loads[ Under the applied loading\ the interface crack is assumed to be partially opened[ Formulation of the problem results in a set of singular integral equations which are solved numerically[ The study shows that the contact zone is extremely small in comparison with the crack length[ Based on the formulation\ some physically meaningful quantities of interest such as stress intensity factors and size of contact zone for a particular material group are analyzed[ Þ 0888 Elsevier Science Ltd[ All rights reserved[