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Materials for Advanced Packaging (Lu, D. and Wong, C.P.) [Book reviews]

✍ Scribed by Ravindran, S.

Book ID: 114583392
Publisher: Institute of Electrical and Electronics Engineers
Year: 2009
Tongue: English
Weight: 492 KB
Volume: 3
Category: Article
ISSN: 1932-4510
DOI: 10.1109/mnano.2009.934216

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