๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Machining of micro rotational parts by wire electrical discharge grinding

โœ Scribed by E. Uhlmann; S. Piltz; D. Oberschmidt

Book ID
107481646
Publisher
Springer-Verlag
Year
2008
Tongue
English
Weight
510 KB
Volume
2
Category
Article
ISSN
0944-6524

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Cutting of polished single-crystal silic
Cutting of polished single-crystal silicon by wire electrical discharge machining
โœ Hideo Takino; Toshimitsu Ichinohe; Katsunori Tanimoto; Syuichi Yamaguchi; Kazush ๐Ÿ“‚ Article ๐Ÿ“… 2004 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 302 KB

Smoothly polished single-crystal silicon plates were cut by wire electrical discharge machining (WEDM) in water and in oil in order to investigate the effect of WEDM on the polished surfaces. For cutting in water, polished surfaces near cut sections have chips and cracks, and are extremely rough; th