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Low Thermal Budget Processing for Sequential 3-D IC Fabrication

✍ Scribed by Rajendran, B.; Shenoy, R.S.; Witte, D.J.; Chokshi, N.S.; De Leon, R.L.; Tompa, G.S.; Fabian, R.

Book ID: 114618644
Publisher: IEEE
Year: 2007
Tongue: English
Weight: 594 KB
Volume: 54
Category: Article
ISSN: 0018-9383
DOI: 10.1109/ted.2007.891300

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