Low-Temperature III–V Direct Wafer Bonding Surface Preparation Using a UV-Sulfur Process

✍ Scribed by Michael J. Jackson; Li-Min Chen; Ankit Kumar; Yang Yang; Mark S. Goorsky

• Book ID: 107457061
• Publisher: Springer US
• Year: 2010
• Tongue: English
• Weight: 288 KB
• Volume: 40
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-010-1397-8