Low temperature fabricated conductive lines on flexible substrate by inkjet printing
β Scribed by Yu-Feng Liu; Weng-Sing Hwang; Yen-Fang Pai; Ming-Hsu Tsai
- Book ID
- 113800478
- Publisher
- Elsevier Science
- Year
- 2012
- Tongue
- English
- Weight
- 1013 KB
- Volume
- 52
- Category
- Article
- ISSN
- 0026-2714
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π SIMILAR VOLUMES
We conducted ink-jet printing of copper (Cu) conductive ink on polyimide (PI) film to form Cu conductive patterns and determine the correlation between Cu ink based on Cu complex and flexible substrate. First, the oxygen plasma treatment was performed to modify the surface property of the PI film, a
## Abstract **Summary:** The driving forces behind the development of flexible electronics are their flexibility, lightweightedness, and potential for lowβcost manufacturing. However, because of physical limitations, traditional thermal processes cause deformations in the flexible substrate. As a r