𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Low-temperature dry etching of tungsten, dielectric, and trilevel resist layers on GaAs

✍ Scribed by S. J. Pearton; C. R. Abernathy; F. Ren; J. R. Lothian; R. F. Kopf

Publisher
Springer
Year
1994
Tongue
English
Weight
796 KB
Volume
14
Category
Article
ISSN
0272-4324

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Integration of Cu and low-k dielectrics:
Integration of Cu and low-k dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures
✍ R.A. Donaton; B. Coenegrachts; M. Maenhoudt; I. Pollentier; H. Struyf; S. Vanhae πŸ“‚ Article πŸ“… 2001 πŸ› Elsevier Science 🌐 English βš– 857 KB

In this work we discuss the importance of selecting the hard mask material and choosing the optimum dry etch and post-CMP clean processes on the integration of Cu and organic low-k dielectrics. The hard mask material plays an important role in the interline capacitance and in the effective dielectri