Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

✍ Scribed by C.S. Tan; D.F. Lim; X.F. Ang; J. Wei; K.C. Leong

• Book ID: 113800462
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 426 KB
• Volume: 52
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2011.04.003