✦ LIBER ✦
(Invited) Cu Surface Passivation with Self-Assembled Monolayer (SAM) and Its Application for Wafer Bonding at Moderately Low Temperature
✍ Scribed by Tan, C. S.; Lim, D. F.
- Book ID
- 121796591
- Publisher
- The Electrochemical Society
- Year
- 2013
- Tongue
- English
- Weight
- 181 KB
- Volume
- 50
- Category
- Article
- ISSN
- 1938-6737
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