Low-temperature anodic bonding of silicon to silicon wafers by means of intermediate glass layers

✍ Scribed by A. Gerlach; D. Maas; D. Seidel; H. Bartuch; S. Schundau; K. Kaschlik

• Publisher: Springer-Verlag
• Year: 1999
• Tongue: English
• Weight: 295 KB
• Volume: 5
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s005420050154