✦ LIBER ✦
Anodic bonding of glass and silicon wafers with an intermediate silicon nitride film and its application to batch fabrication of SPM tip arrays
✍ Scribed by Gen-Wen Hsieh; Ching-Hsiang Tsai; Wei-Chih Lin
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 326 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0026-2692
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