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Low-temperature (≤600 °C) semi-insulating oxygen-doped silicon films by the PECVD technique for large-area power applications

✍ Scribed by F.J. Clough; A.O. Brown; S.N.Ekkanath Madathil; W.I. Milne


Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
530 KB
Volume
270
Category
Article
ISSN
0040-6090

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