This paper describes an integrated-circuit package antenna (ICPA) designed and fabricated using low-temperature cofired ceramic (LTCC) technology for wireless transceivers. The ICPA features a shorting via for frequency-band selection. The measured results show that the prototype ICPA with a size of
Loaded frequency selective surfaces using substrate integrated waveguide technology
✍ Scribed by Rong-Rong Xu; Zhi-Yuan Zong; Guo Yang; Wen Wu
- Publisher
- John Wiley and Sons
- Year
- 2008
- Tongue
- English
- Weight
- 423 KB
- Volume
- 50
- Category
- Article
- ISSN
- 0895-2477
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✦ Synopsis
Abstract
In this article, a novel miniaturized frequency selective surface (FSS) is presented, in which each periodic cell consists of a ring slot resonator loaded with four ceramic chip capacitors for reducing the cell size. To eliminate the undesired coupling between unit cells, the unit cell is placed in the substrate integrated waveguide cavity structure. A S‐band bandpass FSS with such structures is designed and fabricated, both simulated and measured results show that the proposed FSS provides high transmission at 2.45 GHz and there is no other frequency resonance up to 15 GHz. Also, it has very good stability to oblique incidence. Furthermore, the dimension of the proposed FSS is miniaturized to 0.083λ~0~ (λ~0~ refer to the resonant wavelength). © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 3149–3152, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23945
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