Liner materials for direct electrodeposition of Cu

✍ Scribed by Lane, M. W.; Murray, C. E.; McFeely, F. R.; Vereecken, P. M.; Rosenberg, R.

• Book ID: 120363723
• Publisher: American Institute of Physics
• Year: 2003
• Tongue: English
• Weight: 520 KB
• Volume: 83
• Category: Article
• ISSN: 0003-6951
• DOI: 10.1063/1.1610256