Linear fracture mechanics analysis on growth of interfacial delamination in LSI plastic packages under temperature cyclic loading

✍ Scribed by Saitoh, T.; Matsuyama, H.; Toya, M.

• Book ID: 114562004
• Publisher: IEEE
• Year: 1998
• Tongue: English
• Weight: 110 KB
• Volume: 21
• Category: Article
• ISSN: 1070-9894
• DOI: 10.1109/96.730424