๐”– Bobbio Scriptorium
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Lead Free Solder || Theory on Mechanics of Solder Materials

โœ Scribed by Pang, John Hock Lye


Book ID
120378232
Publisher
Springer New York
Year
2011
Weight
175 KB
Category
Article
ISBN
1461404630

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๐Ÿ“œ SIMILAR VOLUMES


Materials update: Lead-free solders
โœ Sungho Jin; Mark McCormack ๐Ÿ“‚ Article ๐Ÿ“… 1994 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 135 KB
Lead-Free Solders: Materials Reliability
โœ Subramanian, K. N. ๐Ÿ“‚ Article ๐Ÿ“… 2012 ๐Ÿ› John Wiley & Sons, Ltd ๐ŸŒ English โš– 91 KB

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al