Lead Free Solder || Finite Element Analysis and Design-for-Reliability
β Scribed by Pang, John Hock Lye
- Book ID
- 120378234
- Publisher
- Springer New York
- Year
- 2011
- Weight
- 857 KB
- Category
- Article
- ISBN
- 1461404630
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al