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Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects

✍ Scribed by Seungbae Park; Ramji Dhakal; Jia Gao

Book ID
107455209
Publisher
Springer US
Year
2008
Tongue
English
Weight
610 KB
Volume
37
Category
Article
ISSN
0361-5235

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