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Lasers at work. New inspection system from US


Book ID
119753243
Publisher
Institution of Electrical Engineers
Year
1982
Weight
347 KB
Volume
61
Category
Article
ISSN
0032-9851

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๐Ÿ“œ SIMILAR VOLUMES


High-speed solder bump inspection system
โœ Hiroyuki Tsukahara; Yoji Nishiyama; Fumiyuki Takahashi; Takashi Fuse; Toru Nishi ๐Ÿ“‚ Article ๐Ÿ“… 2000 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 538 KB

We have developed technologies which inspect the shape of solder bumps. The bumps are used to solder an LSI to a printed wiring board in high-speed workstations. The inspection system developed can measure the height, diameter, and brightness of bumps at very high speed. The bump height is measured