𝔖 Bobbio Scriptorium

✦ LIBER ✦

Laser processing for interconnect technology: H S COLE, Y S LIU, R GUIDA, J ROSE (GE Res. & Dev. Center, Schenectady, NY, USA) Proc. SPIE — Int. Soc. Opt. Eng. (USA), vol. 877, pp. 92–96 (1988). (Micro-Optoelectronic Materials, Los Angeles, CA, USA, 13–14 Jan. 1988)

Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 97 KB
Volume: 20
Category: Article
ISSN: 0026-2692
DOI: 10.1016/0026-2692(89)90024-4

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

High-density interconnects for electroni

High-density interconnects for electronic packaging: C W EICHELBERGER, R J WOJNAROWSKI, R O CARLSON, L M LEVINSON (GE Corporate Res. & Dev., Schenectady, NY, USA) Proc. SPIE — Int. Soc. Opt. Eng. (USA), vol. 877, pp. 90–91 (1988). (Micro-Optoelectronic Materials, Los Angeles, CA, USA, 13–14 Jan. 1988)

📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 99 KB

Physical properties of ceramic-glass-cop

Physical properties of ceramic-glass-copper micro-interconnect systems for VLSI/VHSIC packaging applications: D L SHEALY, H T TOHVER, D A HILL, Z SHEHADEH, G SRINIVASAN, R G THOMPSON, J SHYU (Alabama Univ., Birmingham, AL, USA) Proc. SPIE — Int. Soc. Opt. Eng. (USA), vol. 877 pp. 97–102 (1988). (Micro-Optoelectronic Materials, Los Angeles, CA, USA, 13–14 Jan. 1988)

📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 97 KB